Customization: | Available |
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After-sales Service: | Engineers Can Be Sent to The Worksite |
Warranty: | 1 Year |
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Cylindrical Magnetron Sputtering System For Coating
A series of metal-aluminium nitride (M-AlN) cermet materials for solar selective coatings was deposited by a novel direct current (d.c.) magnetron sputtering technology. Aluminium nitride was used as the ceramic component in the cermets, and stainless steel (SS), nickel-based alloy (NiCr), molybdenum-based alloy (TZM) and tungsten were used as the metallic components. The aluminium nitride ceramic and metallic components of the cermets were deposited by simultaneously running both an aluminium target and another metallic target in a gas mixture of argon and nitrogen. The ceramic component was deposited by d.c. reactive sputtering and the metallic component by d.c. non-reactive sputtering.
The total sputtering gas pressure was 0.8-1.0 Pa and the partial pressure of reactive nitrogen gas was set at 0.020-0.025 Pa which is sufficiently high to ensure that a nearly pure AlN ceramic sublayer was deposited by d.c. reactive sputtering. Because of the excellent nitriding resistance of stainless steel and the other alloys and metal, a nearly pure metallic sublayer was deposited by d.c. sputtering at this low nitrogen partial pressure.
A multilayered system, consisting of alternating metallic and AlN ceramic sublayers, was deposited by substrate rotation. This multisublayer system can be considered as a macrohomogeneous cermet layer with metal volume fraction determined by controlling the thicknesses of metallic and ceramic sublayers. Following this procedure, M-AlN cermet solar selective coatings with a double cermet layer structure were deposited.
The films of these selective surfaces have the following structure: a low metal volume fraction cermet layer is placed on a high metal volume fraction cermet layer which in turn is placed on an aluminium metal infrared reflection layer. The top surface layer consists of an aluminium nitride antireflection layer. A solar absorptance of 0.92-0.96 and a normal emittance of 0.03-0.05 at room temperature have been achieved for these M-AlN cermet solar selective coatings.
DC magnetron sputtering coating machine is usually used for direct sputtering coating for different substrates, such as kinds of plastic, glass, metal, ceramic, etc.
We have dedicated more than 10 years to manufacturing and designing magnetrons that can be rectangular, cylindrical, circular, and of various sizes. They have developed a plethora of targets that can be directly cooled or bonded, and can be manufactured in such a way that can fit most magnetron sizes.
Magnetic fields can essentially define the behaviour and the properties of the ion charged particles that are used for sputtering. The development and commercialisation of software that can enable the distinct modelling of magnetron sputtering is bound to enhance its productivity, applicability, and reproducibility.
Technical Spcifications |
Model Number | SP-1000 | SP-1200 | SP-1400 | SP-1800 |
Dimension of vacuum chamber | 1000*1100 | 1200*1400 | 1400*1600 | 1800*2000 |
(diameter*height) | ||||
Material of vacuum chamber | Carbon steel, SUS304 or SUS316L | |||
Quantity of sputtering cathodes | ≥1 sets, DC sputtering system, cylindrical or rectangle sputtering cathodes | |||
Pumping system | Turbo molecular pumps or diffusion pump+mechanical pump | |||
Pumping Time | From atmosphere to 5.0*10-2Pa less than 8 minutes | |||
Gas distribution System with Mass Flow Controllers | ≥2 sets | |||
Ultimate Vacuum | 5.0*10-4 Pa | |||
Working temperature | Room temperature | |||
Working mode | Automatic or Manual mode, by 10.4(or 15) inches PLC touches screen | |||
Total Power | 40-100kW | 70-1000kW | ||
These units you can custom made | 1. Size of vacuum chamber | |||
2. Quantity of sputtering cathodes | ||||
3. Configurations of pumps | ||||
4. Gas distribution system | ||||
Optional instruments | 1. Coatings thickness monitor | |||
2. Leakage detector | ||||
3. Arc ion deposition system(not for continuous model) | ||||
4. Evaporation system(not for continuous model) |
PS: All the specifications can be customized according to your requests.
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